1. Visual Inspection
Upon arrival, our QC specialists ensure that all packaging, labels and components conform with the original manufacture specifications including MPN number, date code, quantity and visual condition of all goods.
2. Top Marking
One of our main quality control is the marking verification by acetone and scrape test. When performed on a part that has been remarked, the top layer will be removed, revealing evidence of remarking. Through our verification test, we ensure that all component markings are consistent with the original manufacturer's specifications.
3. RoHS verification
XRF can be carried out in electronic parts to evaluate the material composition of the joints and the molding compound. The test will help to detect the presence of prohibited substances such as Pb, variations within the batch, and other discrepancies with an authentic part.
4. X-ray
Widely considered a non-destructive test, X-ray inspection and analysis is a process used to verify the bond wire connections and die size comparison. Besides the detailed X-ray images, our intelligence software can compare all X-ray images with each other and highlights any suspicious inconsistency.
5. Soldering Test
Performing the soldering test by using the dip and look method we can verify if parts aren’t oxidized and are suitable for assembly.
6. Decapsulation & Die inspection
By decapsulation of components, we are able to verify the die inside and read markings and validate if it’s legit or not. For this process, we use a digital microscope with magnification up to 2145x, where even the smallest marking is well readable.
7. Baking
In line with IPC/JEDEC J-STD-033D standards, we can bake parts to ensure all shipped products comply with the manufacturers' required MSL standards and avoid destruction while being populated on PCB.