Quality & Sustainability
Quality control and testing are crucial in the semiconductor sector, and J2 Sourcing recognizes this. Due to the rapid development of technology and the rising demand for high-performance goods, electronic components must meet the highest quality and dependability standards.
To guarantee that the electronic components we supply live up to or beyond expectations, we provide quality control and testing services. Our experienced engineers and technicians use cutting-edge tools and techniques to evaluate and test electrical components thoroughly for performance and reliability.
We conduct a thorough inspection of all incoming electronic components to ensure that they meet our strict quality standards. This includes checking for defects, verifying specifications, and testing for compliance with industry standards.
To maintain a high level of integrity and trust in all business transactions, extensive testing is performed by third-party test facilities in US, China, and Malaysia.
All our partners are certified by strict standards within the military, aerospace, and medical industries.
1. Visual Inspection
Upon arrival, our QC specialists ensure that all packaging, labels and components conform with the original manufacture specifications including MPN number, date code, quantity and visual condition of all goods.
The product is then transferred to our in-house QC area. Detailed photographic documentation starts, which includes checking further parameters such as the component’s dimensions, the manufacturer’s marking and bar code scan.
3. Top Marking
One of our main quality control is the marking verification by acetone and scrape test. When performed on a part that has been remarked, the top layer will be removed, revealing evidence of remarking.
Through our verification test, we ensure that all component markings are consistent with the original manufacturer’s specifications.
4. RoHS verification
XRF can be carried out in electronic parts to evaluate the material composition of the joints and the molding compound to detect the presence of prohibited substances such as Pb, variations within the batch, and other discrepancies with an authentic part.
Widely considered a non-destructive test, X-ray inspection and analysis is a process used to verify the bond wire connections and die size comparison.
Besides the detailed X-ray images, our intelligence software can compare all X-ray images with each other and highlights any suspicious inconsistency.
6. Soldering Test
Performing the soldering test by using the dip and look method we can verify if parts aren’t oxidized and are suitable for assembly.
7. Decapsulation & Die inspection
By decapsulation of components, we are able to verify the die inside and read markings and validate if it’s legit or not. For this process, we use a digital microscope with magnification up to x1000, where even the smallest marking is well readable.
In line with IPC/JEDEC J-STD-033D standards, we can bake parts to ensure all shipped products comply with the manufacturers’ required MSL standards and avoid destruction while being populated on PCB.